Folded Fin Flexible Heatsink for Power Equipment

Product parameters of folded fin flexible heatsink for power equipment

Material: copper

Size：10.9*15.8*3.6CM

Weight: 0.365kg

Technology: Stamping

Feature: Higher cooling ability and good conductivity

Surface treatment: Oil-cleaning passivation

Heat cooling power: 250W

Product advantage of folded fin flexible heatsink for power equipment

Every electrical and electronic component in a circuit generates some amount of heat while the circuit is executed by providing power supply. Typically high-power semiconducting devices like power transistors and the opto electronics such as light emitting diodes,lasers generate heat in considerable amounts and these components are inadequate to dissipate heat, as their dissipation capability is significantly low.

Due to this, heating up of the components leads to premature failure and may cause failure of the entire circuit or system’s performance. So, to conquer these negative aspects, heat sinks must be provided for cooling purpose.

What is a Heat Sink?

Heat sink is an electronic component or a device of an electronic circuit which disperses heat from other components (mainly from the power transistors) of a circuit into the surrounding medium and cools them for improving their performance, reliability and also avoids the premature failure of the components. For the cooling purpose,it incorporates a fan or cooling device.