Small High Dense Copper Skiving Heat Sink For Chip

Product parameters of Small High Dense Copper Skiving Heat Sink For Chip

Material: Copper 1020

Product dimension: 37x37x7mm

Product weight: 0.035 kg

Feature: Reliable performance and durable in surface treatment

Surface treatment: passivation

Heat conducting power: 20W

Product Technology: Skiving + passivation

Product advantage of Small High Dense Copper Skiving Heat Sink For Chip

Skiving fin is the process of relieving Al teeth. The profile is processed into a specific model, such as radiator, etc. with the skiving fin machine tool, the finished product is the skiving fin heat sink.

The skiving fin heat sink is a kind of gap structure with the same sequence formed by cutting the material out of a certain angle by mechanical action of the strip profile (aluminum and copper). It is used to solve the heat dissipation of high-power devices under the condition of air cooling and heat dissipation, and its heat dissipation efficiency can be increased by 8-15% compared with the other heat sink.

With the large-scale application, our skiving fin radiator technology are more mature, the level of automation is gradually improved, our cost and reliability advantages are remarkable. It is used in   UPS, base station, charging pile, frequency converter, controller, wind power converter, SVG, LED lamp.